Qi Bi, Bell-Labs, USA
Ryuji Kohno, Yokohama Nat'l Univ., Japan
Moshe Zukerman, Univ. of Melbourne, Australia
Fabio Leite, ITU, Swiss
Edward Chien, PTTI, USA
Cengiz Evci, Alcatel, France
Justin Chuang, Broadcom, USA
Chai Keong Toh, TRW, USA
Bart Arroyo, European Commission, Belgium
Sastri Kota, Harris, USA
Yile Guo, Nokia, USA
Victor Li, HKU, China
M. Sawahashi, NTT DoCoMo, Japan
G.S.Kuo, National Central University, Taiwan
Ya-Qin Zhang, Microsoft, USA
K.S.Chen, Nat'l Taiwan Univ., Taiwan
D.Goodman, Poly Univ., USA
Khurram Sheikh, Sprint Labs, USA
Fumiyuki Adachi, Touhoku Univ./NTT, Japan
Luigi Fratta, Politecnico di Milano, Italy
Hamid Aghvami, King's College London, UK
Demetrios Kazakos, University of South Louisiana, USA
Robert Berezdivin, Raytheon, USA
Silvia Giordano, EPFL, Switzerland
Yonggang Du, Philips, China
Bernhard Walke, RWTH, Germany
Howard Lemberg, Telcordia, USA
Jae H. Kim, Boeing, USA
M. Mazen Al-Khatib, University of South Alabama, USA
Makoto Miyake, Mitsubishi, Japan
Moon Ho Lee, Chonbuk National University, Korea
Hasan Cam, Arizona State Univ., USA
Howard Xia, Vodafone Airtouch, USA
Dilip Krishnaswamy, Intel, USA
Jinyun Zhang, Mitsubishi Elec.Res.Labs, USA
Steven Yuen, Motorola, USA
Ali Abu-Rgheff, University of Plymouth, UK
Daqing Gu, Mitsubishi, USA
Gang Wu, NTT DoCoMo, USA
Hui Liu, University of Washington, USA
Paul Kolodzy, F.C.C, USA
Ki Ho Kim, Samsung, Korea
Hussein Mouftah, Queen's University, Canada
Zygmunt J. Haas, Cornell University, USA
Xuemin Shen, University of Waterloo, Canada
Petri Mahonen, VTT, Finland
Doug Zuckerman, Telcordia, USA
Shumin Cao, MII, China
Songlin Feng, China Academy of Science, China
Guangxi Zhu, HUST, China
K.Ben Letaief, UST, Hong Kong
Anthony C. Boucouvalas, Bournemouth University, U.K
Guodong Zhang, InterDigital, USA
Jing Wang, Tsinghua Univ., China
Jiandong Li, Xi’dian Univ., China
Willie W. LU, USCWC, USA
Jie Li, Univ. Tsukuba, Japan
Xiao-Hu You, SEU, China
Piu Bill Wong, Astri, Hong Kong
Robert C. Qiu, Tennessee Tech. Univ., USA
Michael Fang, UFL, USA
Markus Dillinger, Siemens, Germany
Xiaoming Fu, Univ. Goettingen, Germany
Seokjoo Shin, Chosun Univ., Korea
Hideyuki Shinonaga, KDDI R&D Labs, Japan
Wenbing Yao, Brunel Univ., U.K.
Zhikui Chen, Univ. Stuttgart, Germany
Stephen Mae, Oracle, USA
Stanley Chia, Vodafone, USA
(Tentative list subject to change. Other members with many IEEE technical program committees may not be included here)
|
